The global 3D ICs market, valued at USD 2,408.2 million in 2012, is expected to see strong growth with 18.1% CAGR during 2013 to 2019. Global semiconductor industry is witnessing shift to 3D IC technology as it provides greater opportunity for developing a broader set of electronic systems and products with exceptional speed, reduction in the chip size, and low power consumption. Rising demand for solutions with improved performance and reduced response time, and growing number of portable devices such as smart-phones and tablets are some of the major factors to drive adoption of 3D ICs. However, high manufacturing and testing cost, lack of foundries and assembly houses to support this technology, thermal and testing issues, are some of the key challenges currently limiting the 3D ICs market growth worldwide.
3D IC technology finds its applications in various end-use sectors such as consumer electronics, military, information and communication technology, automotive and aerospace among others. IC manufacturers use different fabrication process for 3D ICs, depending upon requirements of the circuit system such as beam re-crystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization.
Penetration of 3D IC technology in various applications is dependent on the need of interconnect density and cost related with particular process. Several industry products such as MEMS and sensors, RF SiP, memories, optoelectronics and imaging, logic (3D SiP/SoC) and HB LED are expected to adopt 3D IC integration. Among these products, ‘MEMS and sensors’ and memories are expected to emerge as leading segments. The increasing popularity of memory enhanced applications is expected to drive demand for the memory (3D stacks) segment in the near future. Geographically, Asia Pacific is expected to become largest market for 3D IC technology, with growth primarily supported by its emerging ICT and consumer electronics sector. Asia Pacific is expected to hold largest market share followed by North America throughout the forecast period.
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With the technological advancements, global semiconductor industry is witnessing transition from 2D packaging to 3D packaging to cater to the requirements across end-use industries. 3D IC technology finds widespread applications in micro-electro-mechanical systems (MEMS), wireless devices, sensors, smart imagers, displays, and other electronic devices. They can be manufactured using various processes such as beam re-crystallization, wafer bonding and solid-phase crystallization. With exceptional speed, low power consumption, reduction in chip size and circuit security, 3D ICs provide greater opportunities for developing a broader set of electronic systems and products.
The gradual shift towards 3D ICs occurred with increased demand for solutions with higher bandwidths and density of components. Increasing demand for memory enhanced application is one of the major factors contributing to the market growth of 3D ICs. Reduction in response time, power consumption, form factor and improved performance serve as key drivers for acceptance of 3D IC with TSV interconnect solutions. Moreover, 3D IC technologies are witnessing progressive developments towards management of issues associated with restricted communications capacity, memory latency, and chip signaling. Multi-chip packaging and IntSim CAD tools are some of the emerging technological trends in the 3D ICs market.
Growing demand for solutions with improved performance, quick turn-around time and increasing number of portable devices such as smartphone and tablet are driving the adoption of 3D ICs. Moreover, various industry products such as MEMS and sensors, RF SiP, optoelectronics and imaging, memories (3D Stacks), logic (3D SiP/SoC) and HB LED are expected to deploy 3D IC integration. The most commonly used substrate types for 3D ICs fabrication are silicon on insulator (SOI) and bulk silicon. SOI chips reduce unwanted heat production and parasitic capacitance, and thus they are widely adopted as compared to bulk silicon wafers. As a result, bulk silicon substrates are gradually being replaced by SOI substrates.
This 83-page report gives readers a comprehensive overview of the Global 3D ICs Market. Browse to unlock the hidden opportunities in this market@
The research report on the 3D ICs market provides a detailed analysis of different products types including MEMS and sensors 3D ICs, RF SiP 3D ICs, Optoelectronics and imaging 3D ICs, Memories (3D Stacks) 3D ICs, Logic 3D SiP/SoC 3D ICs, and HB LED 3D ICs and helps in understanding driving forces behind the popularity of 3D ICs in across various end user industries. It also provides analysis for the end user industries of the 3D ICs for the next six years. The report includes extensive analysis of the industry drivers, restraints, market trends and market structure. The market study provides comprehensive assessment of stakeholder strategies and imperatives for succeeding in the business. The report segregates the market based on fabrication process, end user industry, substrate type, product types, and different geographic regions. The report includes a detailed analysis of the prevalent market situation, company profiles and industry trends for 3D ICs used across different application.
The detailed value chain analysis and porter’s five forces analysis helps the market competitors to formulate their business strategies at every stage of their business. Moreover, the market estimates have been analyzed by keeping in mind the several factors including but not limited to technological, economical, social, environmental and legal.
The key players of QSR Ecosystem Market have been profiled with a focus on competitive details such as company and financial overview, business strategies, and their recent developments. The company profile of major players that have been incorporated in this report include Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC), Xilinx Inc., 3M Company, Micron Technology Inc., (Elpida Memory Inc.), Ziptronix, Inc., Tezzaron Semiconductor Corporation, MonolithIC 3D Inc., STATS ChipPAC Ltd. and United Microelectronics Corporation (UMC).